PCB Manufacturing Services
PCB Fabrication Capabilities
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PCB Manufacturing Services In China
Printed circuit boards are custom products. Different industries and different applications require specially manufactured printed circuit boards. JHYPCB is a rare Electronic Manufacturing Service company, providing one-stop contract manufacturing services, including PCB manufacturing, PCB assembly, component procurement, DFM and DFT check, PCBA testing, etc.
In order to continuously improve our production capacity, we are constantly updating our capabilities and equipment to be able to provide printed circuit boards suitable for your application requirements. JHYPCB is well aware of the special needs of customers, we can provide highly reliable, high-quality PCB board manufacturing services with the shortest turnaround time.
Our PCB manufacturing facility has the best equipment, technology, industry-leading talent and innovation. The best service we provide also helps you keep your products competitive.
Whether it is rigid FR-4 PCB, flex PCB, rigid-flex PCB, HDI PCB, impedance control PCB, high frequency PCB, BGA PCB, aluminum PCB or other types of PCB, we have the absolute advantage of low cost and manufacturing capability.
Rigid PCB Fabrication Capabilities
Flex PCB Fabrication Capabilities
Rigid-flex PCB Fabrication Capabilities
Rigid PCB Fabrication Capabilities
The following are the capabilities we at JHYPCB possess in rigid PCB manufacturing.
| NO. | Item | Manufacturing Capability |
|---|---|---|
| 1 | PCB Layers | 1~64 Layer |
| 2 | Quality Grade | IPC Class 2｜PC Class 3 |
| 3 | Laminate/Base material | FR-4｜S1141｜High Tg｜PTFE｜Ceramic PCB｜Polyimide｜S1000-2｜IT180A｜Isola-FR408HR｜FR406｜Isola 370 HR｜Rogers｜Taconic｜Arlon｜Halogen Free, etc. |
| 4 | Brand of Laminate | Kingboard｜ITEQ｜Shengyi｜Nanya｜Isola｜TUC｜SYL｜Arlon｜Nelco｜Taconic｜Hitachi｜Rogers, etc. |
| 5 | High Temperature Material | Normal Tg: Shengyi S1141｜KB6160｜Huazhen H140（not suitable for lead-free process ） Middle Tg: For HDI、multilayers: SY S1000H｜ITEQIT158｜HuazhengH150｜TU-662｜SY S1150G｜HuazhengH150HF｜H160HF； High Tg: For thick copper、high layer: SY S1000-2｜ITEQIT180A｜HuazhengH170｜ISOLA: FR408R｜370HR｜TU-752｜SY S1165 |
| 6 | High Frequency Circuit Board Material | Rogers｜Arlon｜Taconic｜SY SCGA-500｜S7136｜HuazhengH5000 |
| 7 | High Speed PCB Material | SY S7439｜TU-862HF｜TU-872SLK｜ISOLA: I-Speed, I-Tera@MT40｜Huazheng：H175｜H180｜H380 |
| 8 | Ink | Taiyo INK (Japan)｜KUANGSHUN(China)｜RONGDA(China)｜Coates Screen(UK)｜S.M Materials(Taiwan, China) |
| 9 | Heat Conductivity for Alu. Boards | 1.0 |
| 10 | Chemical | Rohm&Haas (US)｜Atotech (Germany)｜Umicore (Germany) |
| 11 | PCB Type and Services | Prototype PCB｜Rigid PCB｜Flexible PCB(FPC)｜Rigid-Flex PCB｜HDI PCB｜High Tg PCB｜BGA PCB｜Impedance Control PCB｜IMS PCB(LED PCB Board, Aluminum PCB, Metal Core PCB)｜Multilayer PCB｜PCBA(PCB Assembly Service) |
| 12 | Max Board Size | 609 * 889 mm |
| 13 | Board Thickness | 0.1~8.0mm |
| 14 | Board Thickness Tolerance | ±0.1mm / ±10% |
| 15 | Min base copper thickness | Outer layer:1/3oz (12um) ~10oz｜Inner layer:1/2oz~6oz |
| 16 | Max finished copperthickness | 6 OZ |
| 17 | Min Mechanical Drilling Hole Size | 6mil(0.15mm) |
| 18 | Min Laser Drilling Hole Size | 3mil(0.075mm) |
| 19 | Min CNC Drilling Hole Size | 0.15mm |
| 20 | Hole Wall Roughness（Max） | 1.5mil |
| 21 | Min trace width/spacing(Inner Layer) | 2/2mil(Outer layer:1/3oz,Inner layer:1/2oz) （H/H OZ base copper） |
| 22 | Min trace width/spacing(Outer Layer) | 2.5/2.5mil （H/H OZ base copper） |
| 23 | Min spacing between hole to inner layer conductor | 6mil |
| 24 | Min spacing between hole to outer layer conductor | 6mil |
| 25 | Min annular ring for via | 3mil |
| 26 | Min annular ring for component hole | 5mil |
| 27 | Min BGA diameter | 8mil |
| 28 | Min BGA pitch | 0.4mm |
| 29 | Min Finished hole size | 0.15mm（CNC）｜0.1mm（Laser） |
| 30 | Half Hole Diameter | Minimum Half hole Diameter: 1mm, Half hole is a special technology, so half hole diameter should be greater than 1mm. |
| 31 | Hole Wall Copper Thickness (Thinnest) | ≥0.71mil |
| 32 | Hole Wall Copper Thickness (Average) | ≥0.8mil |
| 33 | Minimum Air Gap | 0.07mm(3mil) |
| 34 | Fine SMD Pitch | 0.07mm(3mil) |
| 35 | Max aspect ratios | 20:1 |
| 36 | Min soldermask bridge width | 3mil |
| 37 | Soldermask/circuit processing method | Film｜LDI |
| 38 | Min thickness for insulating layer | 2mil |
| 39 | HDI & special type PCB | HDI（1-3 steps）｜R-FPC（2-16 layers）｜High frequency mix-pressing（2-14 layers）｜Buried capacitance & resistance … |
| 40 | Max. PTH (Round Hole) | 8mm |
| 41 | Max. PTH (Round Slot Holes) | 6*10mm |
| 42 | PTH Deviation | ±3mil |
| 43 | PTH Deviation (Width) | ±4mil |
| 44 | PTH Deviation (Length) | ±5mil |
| 45 | NPTH Deviation | ±2mil |
| 46 | NPTH Deviation (Width) | ±3mil |
| 47 | NPTH Deviation (Length) | ±4mil |
| 48 | Hole Position Deviation | ±3mil |
| 49 | Character Types | Serial Number｜Barcode｜QR Code |
| 50 | Min Character Width (Legend) | ≥0.15mm, Characters width less than 0.15mm will be unidentifiable. |
| 51 | Min Character Height (Legend) | ≥0.8mm, Characters height less than 0.8mm will be unidentifiable. |
| 52 | Character Width to Height Ratio (Legend) | 1:5, 1:5 is the most suitable ratio for production. |
| 53 | Distance between Trace and Outline | ≥0.3mm(12mil), Ship as individual boards: Distance between Trace and Outline ≥0.3mm, Ship as Panelized boards with V-cut: Distance between Trace and V-cut line ≥0.4mm |
| 54 | Panelization without Spacing | 0mm, Ship as Panelized boards and the spacing between boards is 0mm. |
| 55 | Panelization with Spacing | 1.6mm, Make sure the spacing between boards should be ≥1.6mm, otherwise it will be hard to process routing. |
| 56 | Surface Finishes | OSP｜HASL｜HASL Lead-Free (HASL LF)｜Immersion Silver｜Immersion Tin｜Plated Gold｜Immersion Gold(ENIG)｜ENEPIG｜Golden Finger+HASL｜ENIG+OSP｜ENIG+Golden Finger｜OSP+Golden Finger, etc. |
| 57 | Solder-Mask Finishing | 1). Wet Film (LPI Soldermask) 2). Peelable Soldermask |
| 58 | Solder Mask Colors | Green｜Red｜White｜Black, Blue｜Yellow｜Orange｜Purple, Gray｜Transparent .etc. Matte: Green｜Blue｜Black, etc. |
| 59 | Silkscreen Colors | Black｜White｜Yellow, etc. |
| 60 | Electrical Testing | Fixture / Flying Probe |
| 61 | Other Testing | AOI, X-Ray(AU&NI), Two-dimension Measurement, Hole Copper Instrument, Controlled Impedance Test(Coupon test&Third Party Report), Metalloscope, Peeling Strength Tester, Solderability Test, Logic Contamination Test |
| 62 | Profile | 1). CNC Routing (±0.1mm) 2). CNC V-Cut(±0.05mm) 3). Bevelling 4). Mould-Die Punching(±0.1mm) |
| 63 | Special Capabilities | Thick Copper, Thick Gold(5U”), Gold Finger, Blind and Buried Hole, Countersink Hole, Semi-hole, Peelable Mask, Carbon Ink, Counter sink hole, Plated board edge, Press fit hole, Control depth hole, VIA in PAD, Non-conductive resin plug hole, Plating plug hole, Coil PCB, Super Mini PCB, Peelable Mask, Controlled Impedance PCB, etc. |
Flex PCB Fabrication Capabilities
The following are the capabilities we at JHYPCB possess in flexible PCB manufacturing.
| NO. | Items | Manufacturing Capability | |
|---|---|---|---|
| 1 | PCB Layers | 1 – 10 Layers | |
| 2 | Laminate | DuPont PI | Shengyi PI | |
| 3 | Maximum PCB Size(Length x Width) | Single-Sided PCB | 480*4000mm |
| Double-Sided PCB | 480*1800mm | ||
| Multilayers | 236*600mm | ||
| 4 | Minimum Board Thickness | Single-Sided PCB | 0.05mm+/-0.02mm |
| Double-Sided PCB | 0.08mm+/-0.02mm | ||
| Multilayers | As per Gerber | ||
| 5 | Finished Board Thickness | 1-6 Layer | 0.05mm-0.6mm |
| 8 Layer | 1.6mm | ||
| 6 | Min Tracing/Spacing | Copper Thickness 1/3 oz: | 0.076mm/0.076mm (1-6L) |
| 0.05mm/0.05mm (8L) | |||
| Copper Thickness 1/2 oz: | 0.076mm/0.076mm (1-6L) | ||
| 0.06mm/0.06mm (8L) | |||
| Copper Thickness 1oz: | 0.1mm/0.1mm (1-6L) | ||
| 0.065mm/0.065mm (8L) | |||
| 7 | Min. Annular Ring | 4mil | |
| 8 | Minimum Hole Size | 0.10mm | |
| 1-6 Layer | 0.2mm(8mil) (CNC) | ||
| 8 Layer | 0.15mm(CNC) | ||
| 9 | Minimum line width/line spacing | 0.045/0.045mm | |
| 10 | Min. PTH size | 0.1mm | |
| 11 | Min. PTH PAD size | 0.2mm | |
| 12 | Min. blind via diameter | 0.075mm | |
| 13 | Min. capture pad size | 0.175mm | |
| 14 | Min. solder mask bridge | 0.065mm | |
| 15 | Coverlay registration tolerance | 0.10mm | |
| 16 | PTH hole size tolerance | ±0.038mm | |
| 17 | Contour tolerance | ±0.05mm | |
| 18 | Impedance tolerance | ±6%(for differential impedance) | |
| 19 | Outside dimensional tolerance | ±0.07mm | ±0.05mm Precision mold | |
| 20 | Min. slot hole width | 0.50mm | |
| 21 | Pitch tolerance | ±0.03mm | |
| 22 | Air Gap capability | Yes | |
| 23 | Panelization Size | 250*510mm | |
| 24 | Solder Mask Color | Green, White, Blue, Black, Red, Yellow | |
| 25 | Solder-stop coating—Coverlay | PI and PET film | |
| 26 | Salt spray tolerance experiment | 24 Hours | |
| 27 | Number of bending resistance of FPC finished products | More than 30 times | |
| 28 | Silkscreen Color | White, Black, Yellow | |
| 29 | Fog Goldfinger Pitch tolerance | ±0.05mm(adhesives FCCL) | |
| ±0.03mm(adhesiveless FCCL) | |||
| 30 | Surface Finish | OSP | |
| HASL | |||
| ENIG(Electroless NickLead-Free Gold) | Ni thickness:2-6um | ||
| Au thickness:0.025-0.05um | |||
| Flash Gold | Ni thickness:2-8um | ||
| Au thickness:0.025-0.15um | |||
| Immersion Tin | Tin thickness:0.5-1um | ||
| PlatingTin | Tin thickness:1-10um | ||
| Laser cuPunching | |||
| 31 | Special technologies | Peelable solder mask | |
| Gold fingers | |||
| Stiffener (only for PI/FR4 substrate) | |||
| Impedance Control+/-10% | |||
| Rigid-Flex PCB | |||
Rigid-flex PCB Fabrication Capabilities
The following are the capabilities we at JHYPCB possess in rigid-flex PCB manufacturing.
| NO. | Item | Usual | Unusual | |
|---|---|---|---|---|
| 1 | PCB Layers | 1 – 12 layers | ||
| 2 | Laminate | Material | Flexible part: DuPont PI, Shengyi PI | ||
| Rigid part: PI/FR4 | ||||
| FR4, for lead-free welding | ||||
| low-loss material | ||||
| Halogen free | ||||
| Special materials: Rogers/Arlon/Nelco/Taconic etc | ||||
| PTFE | ||||
| Polyimide | ||||
| 3 | Delivery Size | Delivery Size | 570X610mm | 570X610mm |
| Production size | 610X640mm | 610X640mm | ||
| 4 | Board Thickness | thinnest | 0.25 mm | 0.20 mm |
| thickest | 5.00 mm | 5.50 mm | ||
| 5 | Finished board thickness tolerance | ±2mil(±0.04m) | ||
| 6 | Copper Thickness | Inner Layer | 1/3-28 OZ | 1/3-30 OZ |
| Outer Layer | 1/7-28 OZ | 1/7-30 OZ | ||
| 7 | Inner Line | Minimum line width | 50μm | 50μm |
| Minimum line spacing | 75μm | 50μm | ||
| 8 | Outer Line | Minimum line width | 75μm | 50μm |
| Minimum line spacing | 75μm | 50μm | ||
| 9 | Min. mechanical Via hole, minimum pad | inner Layer | 0.45 mm | 0.40 mm |
| Outer Layer | 0.40 mm | 0.35 mm | ||
| 10 | Laser Via hole minimum pad | inner Layer | 0.25 mm | 0.23 mm |
| Outer Layer | 0.25 mm | 0.23 mm | ||
| 11 | Thickness to diameter ratio | LBMV | 1:1 | 1:1 |
| MVTH | 1:12 | 1:16 | ||
| 12 | Min. dielectric thickness | Inner core board | 0.025 mm | 0.025 mm |
| Prepreg | 0.05 mm | 0.05 mm | ||
| 13 | Solder resist | min. spacing | 60 μm | 40 μm |
| Min. Solder resist bridge | 75 μm | 65 μm | ||
| 14 | Buried capacitance | Insulation thickness: 14 μm | ||
| unit-area capacitance: 6.4 nF/in2 | ||||
| Breakdown voltage: >100V | ||||
| 15 | Buried resistor | Resistance per unit area(ohms/sq.) : 25, 50, 100, 200 | ||
| 16 | Impedance control accuracy | 10% | 5% | |
| 17 | Plug hole | ink plughole | ||
| resin plug holes | ||||
| copper slurry plughole | ||||
| 18 | Min Tracing/Spacing | 2.5mil/2.5mil | ||
| 19 | Min. Annular Ring | 4mil | ||
| 20 | Min. Drilling Hole Diameter | 8mil(0.15mm) | ||
| 21 | Min. mechanical drilling | 0.15 mm | 0.15 mm | |
| 22 | Laser aperture | 0.10-0.2 0mm | 0.10-0.20 mm | |
| 23 | Min. finished via diameter | 6mil(0.15mm) | ||
| 24 | Tolerance of dimension | 3mil(0.076 mm) | ||
| 25 | Solder Mask Color | Green, White, Blue, Black, Red, Yellow | ||
| 26 | Silkscreen Color | White, Black, Yellow | ||
| 27 | Surface Finish | OSP | ||
| HASL(Hot Air Solder Leveling) | ||||
| HASL Lead-Free | ||||
| Flash Gold | ||||
| ENIG (Electroless Nickle/Immersion Gold) | ||||
| Immersion Tin | ||||
| Immersion Silver | ||||
| 28 | Special technologies | Impedance Control+/-10% | ||
| Gold fingers | ||||
| Stiffener (PI/FR4) | ||||
| Peelable solder mask | ||||
